KYZEN E5631J UnderStencil Wipe Cleaner- Ready to use

SKU code: #IMT00284

Category Name: Cleaning Chemical

₹53,100 (10% off)

MRP

₹59,000

You save ₹5,900(10% off)

Inclusive of all taxes

₹53,100 (10% off)

MRP

₹59,000

You save ₹5,900(10% off)

Inclusive of all taxes

Available Units

Available Stocks : 75

Estimate delivery times: 5-7 days .

KYZEN E5631J UnderStencil Wipe Cleaner- Ready to use

KYZEN E5631J is a ready-to-use stencil cleaning solution designed for removing raw solder paste from stencils in both online understencil wipe and compatible offline cleaning processes. It is formulated for fast, effective cleaning of different solder paste types and is compatible with common stencil materials, cleaning equipment, and major printer platforms.

Specifications

Parameter	Specification
Brand	KYZEN
Product	E5631J
Product Type	Ready-to-Use Aqueous Stencil Cleaner
Pack Size	25 Liters
Concentration	Ready to Use (RTU)
Primary Application	Stencil Cleaning / Understencil Wipe
Cleaning Target	Raw Solder Paste
Process Compatibility	Online & Offline Stencil Cleaning
Operating Temperature	Ambient to 49°C / 120°F
Rinse	DI Water / Solvent
Drying	Warm Air Recommended
pH	N/A
Flash Point	None to Boiling
Boiling Point	100°C / 212°F
Water Solubility	Complete
VOC @ 100%	131 g/L
Storage Temperature	5–50°C / 41–122°F
Compatibility	Common Stencils, Printers & Cleaning Equipment
Nano Coating Compatibility	Does Not Interact With or Remove Nano Coatings

Applications

Understencil Wipe Cleaning – Removes raw solder paste during printing.
Stencil Maintenance – Helps maintain clean stencil apertures.
Online Cleaning – Suitable for printer-integrated cleaning processes.
Offline Stencil Cleaning – Can be used in compatible external processes.
Fine-Pitch Printing – Helps improve solder paste release from small apertures.
SMT Production – Supports consistent print quality and process control.