iTECH HP-B350 Digital Hot Plate (350*300mm)

The HP-B350 Digital Hot Plate is a high-power constant-temperature heating platform designed for PCB preheating, electronics repair, component heating, and industrial heating applications. It features a large 350 × 300 mm working surface, 1800W heating power, and digital temperature control up to 450°C.

Specifications

Applications

• PCB Preheating – Preheats PCB assemblies before soldering, desoldering, or rework.
• BGA Rework Support – Provides bottom-side heating to reduce concentrated thermal stress during component rework.
• Electronics Repair – Useful for controlled heating of circuit boards and electronic assemblies.
• Soldering & Desoldering – Helps bring larger assemblies to a suitable preheat temperature before manual work.
• Component Heating – Provides a controlled heated surface for compatible electronic and mechanical components.
• Industrial Heating – Suitable for general production and laboratory processes requiring a flat heated platform.