Applications

• BGA Rework & Reballing – Suitable for BGA sphere attachment and reballing operations.
• SMD Rework – Helps improve solder wetting during component removal and replacement.
• PCB Soldering – Suitable for soldering and rework across common PCB surface finishes.
• Stencil Application – Can be applied through compatible stencil-printing processes.
• Syringe Dispensing – Suitable for controlled flux application using dispensing syringes.
• Flip-Chip Applications – Designed for compatible flip-chip bumping processes.
• Chip-Scale Packaging – Suitable for applicable CSP assembly and rework processes.